Commit Graph

6 Commits

Author SHA1 Message Date
Jared Boone
0117962a51 Case: Change board outline to add buffer for H1 LED diffuser. 2017-06-19 16:31:54 -07:00
Jared Boone
a14f764665 CPLD: Update LCD thickness, expected lid thickness to 3/16".
Objective is to keep LCD face below plane of case top/lid.
2017-06-19 16:31:54 -07:00
Jared Boone
8b10fde116 Case: Update spacer height. 2017-06-19 16:31:54 -07:00
Jared Boone
3e8a3d8b9a Case: Clean up boss drills. 2017-06-19 16:31:54 -07:00
Jared Boone
b0b027d557 Case: Adjust feet emboss to match manufactured units. 2017-06-19 16:31:54 -07:00
Jared Boone
fcec6d6100 OpenSCAD version of case.
Minor changes were made between this version and the final version. This earlier version is available via Shapeways, at https://www.shapeways.com/product/EGG3EWPAY/portapack-h1-case-round-20150410-0945

Addresses issue #30.
2015-08-01 22:27:08 -07:00